Laird Thermally Conductive PCB Substrate
February 09, 2011
Source: Laird Technologies website datasheets
Laird's Tlam SS 1KA Thermally Conductive PCB Substrate
- The substrate consists of a copper circuit layer bonded to an aluminum or copper base plate with Laird Technologies’ 3 watt/m-K 1KA dielectric.
- Tlam SS 1KA materials are processed through standard FR4 print and etch operations.
- Tlam SS 1KA has 8-10 times better thermal conductivity compared to FR4 and this is the key to keeping components cool.
- The Tlam SS 1KA boards run through standard pick and place SMT and manual wire bond processes.
- Tlam SS 1KA is designed for applications that require the best thermal performance and resistance to ther¬mal cycling.
- Customers have found that Tlam SS 1KA reduces the stress on solder bonds with ceramic devices.
- Standard constructions are made with 1 and 2 ounce copper and 0.040 (1 mm) and 0.062 (1.6 mm) inch thick aluminum.
- Custom constructions of heavier weight circuit copper and thicker aluminum and copper base plates are also available.